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期刊信息 篇名 Novel crosslinking of high-order and multiple copper twins in adavanced microelectronics packaging 语种 英文 撰写或编译 撰写 作者 W. Zhang,C. Z. Liu,D. X. Li,M. L. Sui 第一作者单位 Institute of Metal Research, C...
Copper (Cu) based pastes have emerged as the termination materials of choice for ceramic capacitors with base metal internal electrodes. To prevent oxidation of nickel (Ni) internal electrode and the ...
Four nitrogen-fireable resistor inks with resistivities from 20 Ω/□ to 10 kΩ/□ were examined and found to be based upon lanthanum hexaboride. The firing conditions, especially the peak tem...
Copper films (210 – 1650 Å) were deposited onto glass microslides by vacuum evaporation. The films were subjected to heat treatment at a constant rate and the variation of electrical resistance ...
The applicability of the various copper compositions to the production of thick-film microwave devices has been examined. The results of this work are presented in this paper. The paper presents crite...
The electronics industry has become interested in a thick film materials system based on copper for both technical and economic reasons. Copper conductors offer excellent conductivity, solderability, ...

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